3D Chiplet Engineer

Vertical Compute is a pioneering startup backed by significant funding, dedicated to overcoming memory bottlenecks in AI hardware through proprietary Vertical Integrated Memory (VIM) chiplets. We are currently transitioning from intensive R&D to active engagement with global enterprise customers, offering a unique opportunity to shape the hardware foundation of future AI compute.

Key responsibilities

• Define and implement 2.5D/3D advanced packaging architectures for VIM chiplets, focusing on high-bandwidth and low-power interconnect strategies.
• Collaborate with foundries and internal teams to establish fabrication flows, design rules, and physical design specifications including TSVs and hybrid bonds.
• Conduct multi-physics simulations covering thermal, electrical, and mechanical aspects to optimize system performance and reliability.
• Provide technical leadership and project management guidance to multidisciplinary engineering teams.
• Represent the company in industry events and standardization bodies to drive discussions on future chiplet integration.

Requirements

• 5–10 years of experience in 2.5D/3D packaging and heterogeneous integration.
• Deep expertise in SoC physical design, TSVs, Redistribution Layers, and hybrid bonding at the system level.
• Mastery of the Integrity 3D-IC Platform for defining chiplet interfaces, 3D stacking, and system-level analysis.
• Strong ability to translate ambitious architectural concepts into manufacturable, high-performance designs.
• Excellent communication skills in English, with a collaborative mindset suited for a fast-paced startup environment.

What we offer

• The opportunity to work at the absolute forefront of memory technology innovation.
• A collaborative, inclusive, and human-centric startup culture that values passion and professional growth.
• Meaningful work on projects that will significantly impact the future of computing and electronics.
• A motivating total rewards package and flexible working arrangements.